Wire Bonding ServiceWire Bonding Service

Wire Bonding Service

Assembly Via Wire Bonding

We can solve your device assembly challenges with wire bonding method and with our expert team that deals with it in a daily basis. we solved prototype assembly challenges of integrated circuits and other semiconductor devices to many startup companies and we handled many complicated assembly challenges while working manualy with the wire bonder.

Capabilities:

  • Prototype assembly.
  • Nanoscale wire bonding process.
  • Manual aluminum wedge bonding.
  • Manual ball gold wire bonding.
  • Wire bonding via Au, Cu and Al.
  • Precise bond placement.


Why to use our wire bonding services?

Advanced Knowledge & Experience

Our consultants gained a lot of experience and knowledge while working in different industries, and performing R&D over 25 years in applied science and nanotechnology.

Confidentiality

While performing research and development on our clients projects we are maintaining absolute research confidences, We don't make IP claims over the research.

Facilities

Our wide range of facilities and laboratory equipment helps us to perform R&D on our client's projects, and based on the size of the project we assemble and plan what equipment will be used.

Wide range of experties

our team knowledge divided to many fields in applied science and nanotechnology, it is described in more details in our list of experties and consulting fields: